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<--- TORNA A TELECAMERE XIMEA GMBH

SERIE XiB

Le telecamere della serie XiB sono CMOS con interfaccia PCI, alta risoluzione ed elevati frame rate. Le caratteristiche principali sono:

termocamera Ximea GMBH serie XiB
  • CMOS Veloci: La più alta velocità di acquisizione se utlizzate con le massime potenzialità dell' interfaccia PCI (PCIe x8 Gen3), disponibili con sensori 12 Mpix, 20 Mpix, 50 Mpix o dedicati all' alto frame rate
  • Readout: 7x più veloce della GigE, 17x della USB 3.0, più veloce anche di Camera Link HS o CoaXPress
  • Lunghissime distanze di lavoro: Si possono utilizzare cavi fino a 300m
  • Versatili e con piccole dimensioni: 60 x 60 x 36 mm, 160 grammi
  • Raffreddamento intelligente: Bassi consumi inferiori ai 6 W ed una minima dissipazione con l' aggiunta di ventole
  • Compatibilità: La USB 3.0 supporta Windows 7 e 10, macOS, Linux, ARM e 30 librerie
  • Connettività e sincronizzazione: Sono presenti input ed output isoltati otticamente
  • Controllo delle ottiche: disponibilità di ottiche per il controllo remoto di fuoco, apertura e stabilizzazione dell' immagine.
  • Facilità di ottimizzazione: sono disponibili numerosi accessori per personalizzare il proprio setup, disponibili come Board level, anche con sensore ottimizzato per l' infrarosso (NIR).

MODELLI MONOCROMATICI ED A COLORI XiB:

B/W model Sensor Resolution Pixel µm ADC bits FWC Sensor Diagonal Power Watt DR dB Frames per sec(1)
CB120MG-CM CMOSIS CMV12000 4096 x 3072, 12 MP 5.5 8,10,12 13500 28 mm 8 W 60 133, 103, 86
CB120CG-CM CMOSIS CMV12000 4096 x 3072, 12 MP 5.5 8,10,12 13500 28 mm 8 W 60 133, 103, 86
CB120RG-CM CMOSIS CMV12000 NIR (2) 4096 x 3072, 12 MP 5.5 8,10,12 13500 28 mm 8 W 60 133, 103, 86
CB200MG-CM CMOSIS CMV20000 5120 x 3840, 20 MP 6.4 12 13500 41 mm 6 W 66 33
CB200CG-CM CMOSIS CMV20000 5120 x 3840, 20 MP 6.4 12 13500 41 mm 6 W 66 33
CB500MG-CM CMOSIS CMV50000 7920 x 6004, 48 MP 4.6 12 16000 45 mm 9 W 64 30, 26, 22
CB500CG-CM CMOSIS CMV50000 7920 x 6004, 48 MP 4.6 12 16000 45 mm 9 W 64 30, 26, 22
(1) Full resolution at RAW 8 bits, 10 bits and 12 bits; Server computers with bigger PCIe TLP packet size can increase the throughput by additional 10% (2) Near infrared (enhanced) version of the sensor. Not standard off-the-shelf product. Please contact XIMEA for price and MOQ discussion

CARATTERISTICHE COMUNI:

Sensor technology CMOS, Global shutter
Acquisition modes Continuous, software trigger, hardware trigger
Partial image readout ROI (region of interest) / AOI (area of interest), Skipping / Binning (only certain models)
Image data formats 8, 10, 12 bit RAW pixel data (depends on the model)
SDK/API programmable with C++ and C#
Color image processing* Host based de-Bayering, sharpening, Gamma, color matrix, true color CMS(Color management system)
Hot/blemish pixels correction* On camera storage of up to 5000 pixel coordinates, host assisted correction
Auto adjustments* Auto white balance, auto gain, auto exposure, HDR (High Dynamic Range)

Flat field corrections*

Coming soon. Host assisted pixel level shading and lens corrections
FPN correction Fixed pattern noise correction on the side of the camera
Interface PCI Express standard cable connector compliant to PCI Express External Cabling Specifications
General purpose I/O 2x optoisolated input, 2x optoisolated output, 4 non-isolated input-outputs,4x LED software programmable
Signal conditioning* Programmable debouncing time
Synchronization Hardware trigger input, software trigger, exposure strobe output, busy output
Lens mount Standard EF mount with Active Lens Control – focus, iris, image stabilization
Power requirements 6 Watt, supplied via the power cable (depends on the model)
Dimensions 60 x 60 x 38 mm (depends on the lens mount version)
Weight 175 grams (depends on the model)
Environment Operating 0°C to 50°C on housing, RH 80% noncondensing, -30°C to 60°C storage
Conformity CE, FCC, RoHS, PCI Express External Cabling Specifications compliant
Operating systems Windows 7 SP1 (x86 and x64) and 10, Linux Ubuntu, macOS, ARM
Minimum host hardware

Intel i5 3.0GHz, +2GB RAM available physical memory, Motherboard with PCIe x4 Gen2 (or PCIe x8 Gen3) necessary for full throughput, compliance down to PCIe x1 Gen1 gives reduced throughput

Software support xiAPI SDK, adapters and drivers for 30 various image processing Libraries
Firmware updates Field firmware update through xiCOP.This feature is being developed and tested
(*) Feature is available only when thecamera is in XIMEA API mode.

MODELLI MONOCROMATICI ED A COLORI XiB-64:

B/W model Sensor Resolution Pixel µm ADC bits FWC Sensor Diagonal Power Watt DR dB Frames per sec(1)
CB013MG-LX-X8G3 LUX13HSM 1280 x 864, 1.1 MP 13.7 10 20000 21.1 mm 17 W 60 3500+
CB013CG-LX-X8G3 LUX13HSC 1280 x 864, 1.1 MP 13.7 10 20000 21.1 mm 17 W 60 3500+
CB019MG-LX-X8G3 LUX19HSM 1920 x 1080, 2 MP 10 10 15000 22 mm 17 W 60 2500+
CB019CG-LX-X8G3 LUX19HSC 1920 x 1080, 2 MP 10 10 15000 22 mm 17 W 60 2500+
CB120MG-CM-X8G3 CMOSIS CMV12000 4096 x 3072, 12 MP 5.5 8,10,12 13500 28 mm 17 W 60 330, 300, 130
CB120CG-CM-X8G3 CMOSIS CMV12000 4096 x 3072, 12 MP 5.5 8,10,12 13500 28 mm 17 W 60 330, 300, 130
CB160MG-LX-X8G3(2) LUX160M 4704 x 3424, 16 MP 3.9 10 10000 22.6 mm 17 W 60 300+
CB160CG-LX-X8G3(2) LUX160C 4704 x 3424, 16 MP 3.9 10 10000 22.6 mm 17 W 60 300+
(1) Full resolution at RAW 8 bits, 10 bits and 12 bits; Server computers with bigger PCIe TLP packet size can increase the throughput by additional 10%. (2) Engineering samples available approx. 10/2018, production series 11/2018. Please check our website for updates on schedules or contact XIMEA.

CARATTERISTICHE COMUNI:

Sensor technology CMOS, Global shutter
Acquisition modes Continuous, software trigger, hardware trigger
Partial image readout ROI (region of interest) / AOI (area of interest), Skipping / Binning (only certain models)
Image data formats 8, 10, 12 bit RAW pixel data (depends on the model)
SDK/API programmable with C++ and C#
Color image processing* Host based de-Bayering, sharpening, Gamma, color matrix, true color CMS
Hot/blemish pixels correction* On camera storage of up to 5000 pixel coordinates, host assisted correction
Auto adjustments* Auto white balance, auto gain, auto exposure, HDR (High Dynamic Range)
Flat field corrections* Coming soon. Host assisted pixel level shading and lens corrections
FPN correction Fixed pattern noise correction on the side of the camera
Interface PCI Express standard cable connector compliant to PCI Express External Cabling Specifications
General purpose I/O 2x optoisolated input, 2x optoisolated output, 4 non-isolated input-outputs, 4x LED software programmable
Signal conditioning* Programmable debouncing time
Synchronization Hardware trigger input, software trigger, exposure strobe output, busy output
Lens mount Standard EF mount with Active Lens Control – focus, iris, image stabilization
Power requirements 17 Watt, supplied via power cable
Dimensions 70 x 60 x 55 mm (depends on the version)
Weight 268 grams (depends on the version)
Environment Operating 0°C to 50°C on housing, RH 80% noncondensing, -30°C to 60°C storage
Conformity CE, FCC, RoHS, PCI Express External Cabling Specifications compliant
Operating systems Windows 7 SP1 (x86 and x64) and 10, Linux Ubuntu, macOS, ARM
Minimum host hardware

Intel i5 3.0GHz, +2GB RAM available physical memory, Motherboard with PCIe x4 Gen2 (or PCIe x8 Gen3) necessary for full throughput, compliance down to PCIe x1 Gen1 gives reduced throughput

Software support xiAPI SDK, adapters and drivers for 30 various image processing Libraries
Firmware updates Field firmware update through xiCOP. This feature is being developed and tested
(*) Feature is available only when thecamera is in XIMEA API mode.

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